YESTERDAY YONDER
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03 — INTELLIGENCELONG-TERM AMBITION

Intelligence

A frosted glass optical processor with an orange core
01 / A THOUGHT TAKES SHAPE

Artificial intelligence
that can learn and act.

AI for research, creative work and complex problem-solving. A long-term ambition for YY.

ASSEMBLEDEXPLODED
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Inside the glass

A packaging-informed art study.

  1. Glass shell

    The YY material treatment. Real packages commonly use other encapsulation materials.

  2. Silicon dies + bond wires

    Two non-overlapping dies. Each arched copper bond ends on a defined pad and lead landing.

  3. Copper lead frame

    112 separate metal leads inside 28 glass contact groups. Each lead has its own modeled connection.

  4. Carrier + base

    Separate die-attach paddles and a transparent base hold the assembled composition.

The opened gaps are an exploded illustration. The die pattern, materials and scale are artistic; this is not a functional circuit or an electrically validated chip.

Packaging references: Texas Instruments: die-to-lead connections · TI package families